Thermal Analysis of Different Components on the PCB Using ANSYS Software

The continuous advances in the electronic industry have increased the demand for a high performance, lightweight, thin and small miniaturisation of the ICs. The advance in the technology tends to the reduced transistor size and closely packed layouts, due to which the heat dissipation increases which rises the temperature and causes adverse effects, resulting in reduced system reliability. Therefore, the thermal analysis of the PCB design becomes increasingly important. This paper presents the steady state thermal analysis of different blocks which are the electronic component modules on the PCB board using a software tool named ANSYS. Using this tool, the high temperature areas, i.e. the thermal hotspots and low temperature areas on the PCB board, can be identified; using this analysis, the temperature-sensitive components can be placed reliably on the PCB board to ensure proper functionality of the system.