光掩模
光刻胶
光刻
极紫外光刻
平版印刷术
材料科学
无光罩微影
计算光刻
抵抗
下一代光刻
X射线光刻
制作
光电子学
光学
纳米技术
电子束光刻
图层(电子)
物理
病理
医学
替代医学
作者
Xiaodong Pi,Ying Shi,Xuegong Yu
标识
DOI:10.1007/978-981-99-2836-1_78
摘要
The photolithography is the most critical step for the IC fabrication, among which the photomask and photoresist are the necessary materials. The photomask is commonly used as the printing master plate on the photolithography process. The mask pattern can be transferred on the substrates with the help of the photoresist. The basic knowledge on the photomask, photoresist, phase-shift mask, DUV lithography photomask, and DUV photoresist has firstly been introduced in this chapter. With the development of lithography technology, extreme ultraviolet (EUV) and mask technology have attracted most attention, concerning the EUV lithography photomask and photoresist. Then, next-generation lithography materials have also been prospected. Moreover, photosensitive polyimides, antireflection coating, and ancillaries have also been illustrated.
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