Electrospun fiber-based flexible electronics: Fiber fabrication, device platform, functionality integration and applications

材料科学 数码产品 静电纺丝 电容感应 可穿戴技术 柔性电子器件 可伸缩电子设备 可穿戴计算机 纳米技术 计算机科学 复合材料 电气工程 嵌入式系统 工程类 聚合物
作者
Qiang Gao,Seema Agarwal,Andreas Greiner,Ting Zhang
出处
期刊:Progress in Materials Science [Elsevier]
卷期号:137: 101139-101139 被引量:45
标识
DOI:10.1016/j.pmatsci.2023.101139
摘要

Flexible electronics have attracted considerable attention in the past two decades due to their distinctive features and numerous potential applications in electronic skins, human–machine interfaces, flexible displays, wearable sensors, portable energy devices, and implantable devices. Electrospun fibers offer excellent mechanical properties and tailored physicochemical properties, which are highly promising for the fabrication of emerging flexible electronics. This article provides a comprehensive review of the electrospun fiber-based flexible electronics, ranging from the introduction of electrospinning technology, diversity of electrospun fibers, and integration strategy of electrospun fiber electronics to various sensing platforms, including an electrode, resistive, capacitive, piezo/triboelectric, electrochemical, and transistor types. These electrospun fiber-based sensing devices can be integrated within multiple sensing modalities, wireless communication, self-power, and heat management function, and benefit from the advantages of electrospun fibers, such as flexibility, robustness, high porosity, diverse fiber morphology and assembly, lightweight, and low-cost, these electrospun fiber-based flexible electronics play an increasingly significant role in daily life for the monitoring of individual healthcare, including biophysical signal detection, biochemical signal detection, electrophysiological signal detection, and promoting cell and tissue regeneration serving as implantable devices. At the end of the review, several future ways to go with electrospun fiber-based flexible electronics are proposed.
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