Role of void nucleation at primary-γ'/γ interface on strain softening of nickel base superalloy 720Li

材料科学 电子背散射衍射 成核 高温合金 微晶 极限抗拉强度 软化 空隙(复合材料) 复合材料 可塑性 合金 硬化(计算) 应变硬化指数 大气温度范围 冶金 微观结构 热力学 物理 图层(电子)
作者
P.S.M. Jena,Sushree Swarupa Tripathy,B. Mahato,N. Paulose,D.C. Fernando,J.K. Sahu
出处
期刊:Journal of Alloys and Compounds [Elsevier]
卷期号:958: 170388-170388 被引量:5
标识
DOI:10.1016/j.jallcom.2023.170388
摘要

High-temperature tensile deformation behavior of polycrystalline nickel based superalloy 720Li used for manufacturing aero engine disks was studied by conducting uniaxial tensile tests in the temperature range of 25–800 °C and subsequent transmission and scanning electron microscopic examinations to decipher strain hardening/softening behavior. The alloy is strengthened by different sizes of γ'-precipitates named as primary, secondary, and tertiary-γ'. The sizes of primary γ' is in the range of 0.5–3 µm and most of them are incoherent with γ-matrix as confirmed by the TEM study. From engineering stress-strain curves, it was observed that specimens tested in the temperature range 25–650 °C exhibited a significant amount of strain hardening, whereas specimens tested at 720 and 800 °C softened after the onset of plastic yielding. From extensive SEM examinations, it is concluded that void nucleation at primary-γ'/γ interface at 720 and 800 °C was the main reason for strain softening after the onset of plastic yielding. Nucleation of voids at primary-γ'/γ interface is ascribed to (i) γ' size, which loses coherency with the matrix after reaching a critical value (rcrit); and (ii) difference in Schmid factor between γ' precipitate and γ matrix, which varies with test temperature. From the misfit data, the rcrit values were calculated at 25 and 800 °C and are found to be in the range of 1250–1500 nm and 150–200 nm, respectively. From the electron backscatter diffraction (EBSD) analysis, it is confirmed that at 720 and 800 °C when the difference in Schmid factors between γ' precipitate and γ-matrix is ≥ 0.1, the probability of formation of the void is high.

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