48‐2: Research on Mechanical Simulation of Flexible AMOLED Module Bottom Frame

With the development of science and technology and consumers' pursuit of high screen ratio, the frame of terminal flagship products has become an important research direction. However, the thinner the bottom frame is, the higher probability of metal wire breakage in bending area. In this paper, we use finite element analysis to simulate the whole bending process of bottom frame, study the influence of bending path, indenter displacement, bending radius and buffer zone on metal wire, summarize the failure mechanism, which provides theoretical basis for fault analysis, stacking structure design and smaller radius design.