Improvement of the anti-corrosion coating properties of waterborne epoxy resin with the incorporation of fluoropolymer-modified silica nanofillers

The objective of this research was to enhance the corrosion resistance and mechanical properties of silica nanoparticles modified by a fluoropolymer (polyhexafluorobutyl acrylate, PHFBA) by incorporating them into a waterborne epoxy resin (WEP) coating system. Initially, polyhexafluorobutyl acrylate (PHFBA)-modified silica nanoparticles were synthesized using a two-step method, involving the grafting of 3-(isobutylloxy) propyl trimethoxysilane (KH570) onto SiO2 to produce SiO2@KH570, followed by a random copolymerization of SiO2@KH570 with hexafluorobutyl acrylate (HFBA) to obtain the fluoropolymer-modified SiO2 (FxSiO2). Subsequently, the chemical structure and elemental composition of SiO2, as well as the prepared SiO2@KH570 and FxSiO2 nanoparticles, were comprehensively investigated. Moreover, FxSiO2/WEP composite coatings with different amounts of fluoropolymer-modified nanofillers and x-F5SiO2/WEP composite coatings with varying amounts of F5SiO2 nanofillers were prepared and characterized. The findings revealed that the functionalized FxSiO2 exhibits superior dispersion, interface, and size effects, significantly enhancing the overall performance of WEP coatings. Notably, when 0.1 wt% F5SiO2 nanofiller was incorporated, the resulting 0.1-F5SiO2/WEP composite coating demonstrated a considerable impedance modulus (1.171 × 108 Ω∙cm2), relatively low water absorption rate (about 11 % after 20 d of immersion in water), and robust mechanical properties: a tensile strength of 6.07 MPa and an elongation at break of 37.36 %. Moreover, the hardness and adhesion of the composite coating remain unaltered. Furthermore, after 20 days of salt spray testing, the electrochemical impedance still reached 8.765 × 106 Ω∙cm2, indicating a favorable long-term anti-corrosion capability. Consequently, the integration of fluoropolymer-modified nanoparticles in water-based epoxy resins holds great potential.