肖特基二极管
材料科学
光电子学
二极管
可靠性(半导体)
碳化硅
击穿电压
电气工程
高压
电压
工程物理
电子工程
功率(物理)
工程类
物理
复合材料
量子力学
作者
In-Hwan Ji,Anoop Mathew,Jae Hyung Park,Neal Oldham,Matthew McCain,Shadi Sabri,Edward Van Brunt,Brett Hull,Daniel J. Lichtenwalner,D. A. Gajewski,John W. Palmour
标识
DOI:10.1109/irps48203.2023.10118095
摘要
For high power full SiC modules, the application requires highly reliable and robust 4H-SiC diodes in parallel with SiC MOSFETs. This work introduces new large size (50A rated) 1200V and 1700V 4H-SiC diodes which exhibit excellent performance under high temperature reverse bias (HTRB) and high voltage high temperature humidity (HV -H3TRB) conditions without sacrificing critical device performance such as forward voltage dropr $\mathbf{(Vf)}$ , Schottky Barrier height and ideality factor, and reverse leakage current. In this work, we have improved the device integration scheme for diode manufacturing, which enabled the successful completion of HTRB and HV-H3TRB qualification for automotive application.
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