Tutorial #4 Smart Cut™: Engineered substrate for device performance enhancement

For decades, Smart Cut TM technology has offered a wide range of engineered substrates produced in high volume manufacturing.It opened a large product portfolio, including numerous silicon on insulator (SOI) generations, allowing 2.5D/3D device integration and opening the path to enhanced silicon carbide materials.In this talk, we will review the main features of the Smart Cut TM process, and focus on some of the specificities attached to its applications.Among other examples, we will consider the atomic layer thickness control allowing fully-depleted device ultra-low variability, or the new ultra-highly conductive SmartSIC TM materials.