Thermal transport properties of GaN with biaxial strain and electron-phonon coupling

Strain inevitably exists in practical GaN-based devices due to the mismatch of lattice structure and thermal expansion brought by heteroepitaxial growth and band engineering, and it significantly influences the thermal properties of GaN. In this work, thermal transport properties of GaN considering the effects from biaxial strain and electron-phonon coupling (EPC) are investigated using the first principles calculation and phonon Boltzmann transport equation. The thermal conductivity of free GaN is 263 and 257 W/mK for in-plane and cross-plane directions, respectively, which are consistent better with the experimental values in the literature than previous theoretical reports and show a nearly negligible anisotropy. Under the strain state, thermal conductivity changes remarkably. In detail, under +5% tensile strain state, average thermal conductivity at room temperature decreases by 63%, while it increases by 53% under the −5% compressive strain, which is mostly attributed to the changes in phonon relaxation time. Besides, the anisotropy of thermal conductivity changes under different strain values, which may result from the weakening effect from strain induced piezoelectric polarization. EPC is also calculated from the first principles method, and it is found to decrease the lattice thermal conductivity significantly. Specifically, the decrease shows significant dependence on the strain state, which is due to the relative changes between phonon-phonon and electron-phonon scattering rates. Under a compressive strain state, the decreases of lattice thermal conductivity are 19% and 23% for in-plane and cross-plane conditions, respectively, comparable with those under a free state. However, the decreases are small under the tensile strain state, because of the decreased electron-phonon scattering rates and increased phonon anharmonicity.