极紫外光刻
抵抗
材料科学
极端紫外线
平版印刷术
下一代光刻
X射线光刻
光电子学
纳米颗粒
光刻
光学
纳米技术
电子束光刻
激光器
物理
图层(电子)
作者
Kazuki Kasahara,Vasiliki Kosma,Kazunori Sakai,Emmanuel P. Giannelis,Christopher K. Ober,Kou Yang,Hong Xu
摘要
Extreme ultraviolet (EUV) lithography, using 13.5 nm radiation, is considered one of the most prominent candidates for next generation lithography. The main challenge for EUV resists is to simultaneously satisfy resolution, LWR (line-width roughness) and sensitivity requirements according to the ITRS roadmap1. Over the past few years, our main effort has been to focus on ZrO2 and HfO2 nanoparticle-based photoresists. However, both Zr and Hf are relatively low EUV absorbing metals2, and integration of high EUV absorption elements is considered to be a more promising route to further improve lithographic performance under EUV radiation. Here, we demonstrate novel zinc oxide-based nanoparticle photoresists, possessing small particle size, good solubility in spin-coating solvents, good film-forming abilitie and patterning by incorporating a photo-acid generator or photo-radical generator.
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