High heat flux dissipation via interposer active micro-cooling

In this work we demonstrate that high power density of 600 W cm−2 can be effectively dissipated by conductive/convective cooling using a silicon interposer with integrated micro-channels. This technology proved to limit the temperature increase of a 5 mm2 power chip to only 34 K when operated at 150 W. The cooler technology is developed on a silicon semiconductor platform and is applicable to interposer technologies.