材料科学
复合材料
形状记忆合金
电磁屏蔽
热导率
相变材料
导电体
热能储存
热的
生态学
生物
物理
气象学
作者
Yingjie He,Yao-wen Shao,Yuan-yuan Xiao,Jing‐hui Yang,Xiao‐dong Qi,Yong Wang
标识
DOI:10.1021/acsami.1c23303
摘要
Multifunctional phase change materials (PCMs) are highly desirable for the thermal management of miniaturized and integrated electronic devices. However, the development of flexible PCMs possessing heat energy storage, shape memory, and adjustable electromagnetic interference (EMI) shielding properties under complex conditions remains a challenge. Herein, the multifunctional PCM composites were prepared by encapsulating poly(ethylene glycol) (PEG) into porous MXene/silver nanowire (AgNW) hybrid sponges by vacuum impregnation. Melamine foams (MFs) were chosen as a template to coat with MXene/AgNW (MA) to construct a continuous electrical/thermal conductive network. The MF@MA/PEG composites showed a high latent heat (141.3 J/g), high dimension retention ratio (96.8%), good electrical conductivity (75.3 S/m), and largely enhanced thermal conductivity (2.6 times of MF/PEG). Moreover, by triggering the phase change of the PEG, the sponges displayed a significant photoinduced shape memory function with a high shape fixation ratio (∼100%) and recovery ratio (∼100%). Interestingly, the EMI shielding effectiveness (SE) can be adjusted from 12.4 to 30.5 dB by a facile compression-recovery process based on shape memory properties. Furthermore, a finite element simulation was conducted to emphasize the advantage of the MF@MA/PEG composites in the thermal management of chips. Such flexible PCM composites with high latent heat storage, light-actuated shape memory, and adjustable EMI shielding functions exhibit great potential as smart thermal management materials in military and aerospace applications.
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