Lithographic Resists

Abstract This article provides an overview of the chemistry and processes used to form micro‐ and nanoscale patterns for the fabrication of semiconductors and other electronic devices. The basic functional attributes of lithographic resists and the physical principles of modern lithographic process technologies are addressed. The imaging chemistry of the major classes of resists in current use is described. A detailed discussion of chemically amplified resists, the most widely used class of resist, summarizes their evolutionary development, mechanisms of imaging chemistry, key processing characteristics, and factors that limit ultimate extendibility. A number of newly emerging techniques for lithographic patterning are described.