Properties and microstructure of copper/graphite composites with copper‐coated graphite fabricated by electroless plating and spark plasma sintering

石墨 放电等离子烧结 材料科学 复合材料 微观结构 烧结 润湿 冶金 电镀(地质) 地球物理学 地质学
作者
Xiaowei Feng,Bo Feng,Qi Xiao,J. Wang
出处
期刊:Materialwissenschaft Und Werkstofftechnik [Wiley]
卷期号:53 (7): 848-858 被引量:2
标识
DOI:10.1002/mawe.202100077
摘要

Abstract In order to improve the interfacial bonding between copper and graphite, copper was coated on the graphite by electroless plating. Copper/graphite composites with copper‐coated graphite were fabricated by spark plasma sintering. The effects of copper‐coated graphite on the density, electrical conductivity, mechanical properties, friction and wear properties of copper/graphite composites were studied. The results show that: copper plating on the graphite surface can improve the wettability of graphite and copper, and the interface between them is well bonded. Compared with pure copper, the microstructure of the composites was significantly refined after adding copper‐coated graphite. The mechanical properties of the composites were significantly improved, with yield compressive strength and elastic modulus increasing by 220 % and 240 %, respectively. With the increase of copper‐coated graphite contents, the density and the conductivity of the composites gradually decreased. The friction coefficient and wear rate of the composites were significantly reduced. The friction and wear mechanisms of the composites are mainly oxidation wear, fatigue wear and adhesive wear.
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