Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package

With the continuous development of packaging technology, the warping problem has attracted more and more attention, which may lead to reduced solder joint life and TIM coverage, so how to accurately predict package warping becomes particularly important. This paper firstly studies the simulation accuracy of two different methods with 25mm FCBGA package, among which the simulation method based on Birth-and-Death element technology is in good agreement with test results. Then, multi-factor DOEs simulation is carried out to study the influence trend and degree of each factor on warping by changing the factors such as Lid thickness, foot width, Core thickness and core type. It is found that lid thickness and core thickness have significant influence on packaging warpage.