硅
光纤
光电子学
材料科学
功率(物理)
集成光学
计算机科学
物理
电信
量子力学
作者
Karl Muth,Vivek Raghuraman,Sukeshwar Kannan,Hari Potluri
标识
DOI:10.1109/ectc51909.2023.00044
摘要
This paper shows the necessary technologies for SiPh based optical I/Os merging mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency (highest density, lowest power and cost). An early Broadcom CPO (co-packaged-optics) prototype system is demonstrated, and main performance parameters are reported.
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