材料科学
复合材料
刮擦
脆性
陶瓷
成核
研磨
各向异性
碳化硅
偏转(物理)
物理
光学
化学
有机化学
量子力学
作者
Menghua Zhang,Chenwei Shan,Ziwen Xia,Ming Luo,Kai Tang
标识
DOI:10.1016/j.ijmecsci.2023.108885
摘要
Due to the extremely complex composition of C/SiC composites, their material removal mechanisms are significantly different from those of conventional single-phase ceramic materials. Therefore, the grinding removal mechanism of C/SiC composites must be investigated so that the components based on these composites can be machined efficiently and with low damage. In this paper, nano-scratch experiments with various cutting depths are carried out along different fiber orientations to simulate the material removal process in grinding and theoretically clarify the damage failure mechanism based on different cutting thicknesses. According to the assessment of surface and subsurface morphology of the various constituents in the scratch grooves regarding different fiber orientations, the multiple brittle breakage modes and surface integrity of carbon fiber are revealed. Green's function is applied to establish a half-space anisotropic analytic elastic stress field considering the microstructural characteristics of material, and the crack nucleation and propagation principles during micro brittle fracture regime for nano-scratch experiment are elucidated based on the fracture mechanics and the maximum principal stress criterion. The formation mechanism of machined surface morphology in macro brittle removal process is investigated under the crack deflection effect at the weak interface and based on the elastic foundation beam theory. The related findings can provide a reasonable reference framework for optimizing the grinding technology, material and tool design regarding C/SiC composites.
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