材料科学
石墨烯
热导率
电磁屏蔽
多孔性
复合材料
电磁干扰
电磁干扰
数码产品
热的
光电子学
纳米技术
电子工程
电气工程
物理
气象学
工程类
作者
Fan Yang,Ping Xie,Xianbin Liu,Haijie Zhao,Ting Liu,Yanhong Yin,Yesheng Li,Ziping Wu
出处
期刊:Carbon
[Elsevier BV]
日期:2023-08-18
卷期号:214: 118380-118380
被引量:22
标识
DOI:10.1016/j.carbon.2023.118380
摘要
With the rapid development of portable electronics, the demand for flexible shielding and thermal management materials is increasing steadily. Herein, we reported a scalable flexible graphene film preapred following hydrogen iodide chemical reducing and graphitization thermal reducing. Benifitting from the coordinated reduction, the fabricated graphene film is equipped with varous characteristics of high orientation, rich defect and three-dimensional porosity. Then the graphene film deliver outstanding mechanical property and electrical conductivity (1.2 × 105 S m−1). Moreover, superior electromagnetic interference (EMI) and thermal conductivity are realized compared with the simplex thermal reduction. The EMI effectiveness can reach a high value of 70 dB when the thickness is only 35 μm, and the specific EMI effectiveness is 380 dB/g cm−3. And the relationship between the effectiveness and structure parameters (thickness and density) is uncovered. The thermal conductivity could be up to 864 W m−1 K−1. This research may not only provide a new avenue to the development of flexible shielding and thermal management materials, but also promote the application of graphene.
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