热固性聚合物
单体
形状记忆聚合物
材料科学
聚合物
形状记忆合金
聚合
固化(化学)
聚合物网络
复合材料
拓扑(电路)
分子动力学
互穿聚合物网络
自由基聚合
高分子化学
计算化学
数学
化学
组合数学
作者
Collin D. Wick,Andrew J. Peters,Guoqiang Li
出处
期刊:Polymer
[Elsevier]
日期:2023-07-01
卷期号:281: 126114-126114
标识
DOI:10.1016/j.polymer.2023.126114
摘要
Chemically crosslinked thermoset shape memory polymers (TSMPs) can combine the strength required for load-carrying structures and devices with stimuli-responsive properties that can allow them to perform crack-closing or other multifunctional properties. In particular, UV-curable shape memory polymers can be used for 3D printing, and to enhance the design process, a molecular dynamics (MD) modeling framework was developed to study them. The MD simulations were used to calculate thermophysical, mechanical, and shape memory properties for glycerolate dimethacrylate after UV-curing to form a polymer network. Semiquantitative agreement between simulation and experiment was achieved for the different properties compared. By examining various conditions for network formation, a range of distinct cross-linking topologies were generated and their effects on properties were evaluated. In particular, it was found that the percentage of monomers with the maximum number of possible links with other monomers had a greater correlation with recovery stress than the number of monomers reacted overall. A new topological fingerprint, the average minimum pathway between monomers, was proposed and found to have the strongest correlation with recovery stress than all properties examined.
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