材料科学
热导率
复合数
石墨烯
复合材料
导电体
数码产品
基质(水族馆)
消散
纳米技术
电气工程
海洋学
物理
工程类
地质学
热力学
作者
Mengting Yan,Weihong Jia,Yawen Yang,Qi Zhou,Limin Ma,Jinqing Wang
出处
期刊:Coatings
[Multidisciplinary Digital Publishing Institute]
日期:2023-02-10
卷期号:13 (2): 407-407
被引量:1
标识
DOI:10.3390/coatings13020407
摘要
High-efficient heat dissipation materials are urgently required in advanced electronic packaging technology because effectively releasing the internal heat flow density of electronic devices is a key factor during their operation. In this work, a novel vertical graphene nanosheets/carbon fibers (VGNs/CF) composite film, with a vertically oriented structure and excellent heat dissipation properties, is fabricated on the stainless steel substrate by a facile thermochemical growth method. The preparation of composite film is green, safe, and highly efficient. CF is used as a thermally conductive filler to provide thermal conductivity channels for VGNs, and both of them construct a continuous thermally conductive network. The through-plane thermal conductivity of the VGNs/CF composite film could reach 17.7 W/(m·K), and the addition of CF significantly improved the heat dissipation performance of the composite film compared with the pure VGNs film (13.9 W/(m·K)). Conclusively, the simple preparation method and outstanding thermal conductivity capacity of the VGNs/CF composite film are expected to meet the application requirements of the electronics industry.
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