作者
Tomonori Mizushima,Kensuke Takenaka,Hiroyuki Fujisawa,Tomohisa Kato,Shinsuke Harada,Yasunori Tanaka,Mitsuo Okamoto,Mitsuru Sometani,Dai Okamoto,Naoki Kumagai,Shinichiro Matsunaga,Tadayoshi Deguchi,Manabu Arai,Tetsuo Hatakeyama,Youichi Makifuchi,Tsuyoshi Araoka,Naoyuki Oose,Takashi Tsutsumi,Mitsuru Yoshikawa,Katsumi Tatera,Atsushi Tanaka,Syuji Ogata,Koji Nakayama,Toshihiko Hayashi,Katsunori Asano,Masayuki Harashima,Yukio Sano,Eisuke Morisaki,Manabu Takei,M. Miyajima,Hiroshi Kimura,Akihiro Otsuki,Yoshiyuki Yonezawa,Kenji Fukuda,Hajime Okumura,Tsunenobu Kimoto
摘要
4H-SiC carbon face flip-type n-channel implantation and epitaxial (IE)-IGBT with an epitaxial p ++ substrate was developed and its switching test was carried out. We were able to achieve an ultrahigh blocking voltage greater than 16 kV, extremely low V on (6.35 V at 20 A), and good temperature stability. The switching operation was achieved by connecting three IGBTs in parallel, with a total I CE of 60 A and V CE 5 kV. The turn-off loss and turn-on loss were about 220 mJ and 120 mJ, respectively at room temperature. They show low switching loss of ultrahigh voltage SiC IE-IGBT and the possibility of large scale module with parallel connection.