Thermal conductivity and diffusivity of wood

热传导 热扩散率 热导率 材料科学 复合材料 各向异性 多孔性 传热 横截面 硬木 热的 实木 热力学 光学 物理 生态学 结构工程 图层(电子) 生物 工程类
作者
Bashir M. Suleiman,Jenny Larfeldt,Bo G Leckner,M. Gustavsson
出处
期刊:Wood Science and Technology [Springer Science+Business Media]
卷期号:33 (6): 465-473 被引量:234
标识
DOI:10.1007/s002260050130
摘要

Transient simultaneous measurements of thermal conductivity and diffusivity of Swedish wood have been performed with the plane source technique on oven-dry hardwood (birch) samples at room temperature and at 100 °C. The influences of temperature, density, porosity and anisotropy on thermal conduction were investigated. The measurements were done in longitudinal (parallel to the grain) and transverse (intermediate between radial and tangential) directions. As the temperature increased from 20 to 100 °C, the thermal conductivity of each sample increased slightly for both longitudinal and transverse directions. The effect of density and porosity on the thermal conductivity may be related to the presence of other scattering mechanisms such as voids and cell boundaries. It seems that the dominant mechanism of heat transfer across the cell lumina in these types of wood is the heat conduction through the voids. An attempt was made to explain the behaviour of the effective thermal conductivity by adopting a model based on the ratio between heat conduction in parallel and serial layers of gas, liquid, and solid phases.

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