P‐172: Study on The effect of Module Films on Metal Wire Strain During the Pad bending Process

Based on ABAQUS mechanical simulation software and the same bending radius, this paper simulated and an alyzed the strain change trends of metal wires on the different schemes for other key influencing films, such as BPL, PI and TPOC. On the basis of the simulation results, the conclusions are follows: PI thickness thinn ing or TPOC thickness increases can decrease the stra in of the metal wires at bending region. However, the change of BPL thickness has no significant effect.