Implementation of Low Power Diode Laser for Soldering by FPC ( Fibre Push Connection) Method

The advances in miniaturisation and ever increasing complexity of integrated circuits frequently mean an increase in the number of connections to a component with simultaneous reduction in pitch. For these emerging smaller contact geometries, micro‐laser connection technologies are required. The reliability of the connection plays a decisive role. The implementation and reproducibility of laser connections technology in micro‐electronics depend on good thermal contact between the two parts and high quality absorption of the material surface used. Laser energy can cause local melting due to overheating of the lead because of the low distance between lead and bump. This effect influences the reproducibility of the contacts. Even the slightest interruption in the thermal contact of the parts can cause non‐reproducibility of the contacts. Materials with a higher quality of absorption, for example Sn(32% ), can be soldered with a good level of reproducibility. This clearly differs from gold (4% ) or copper(7% ...