Measurements of angular distributions of sputtered material as a new tool for surface-segregation studies: Segregation in CuPt alloys

The angular distribution of copper and platinum sputtered by argon ions from polycrystalline CuPt targets at 77 K has been measured by a collection technique. The argon-ion energy has been varied from 1.25 to 320 keV. For bombardment energies above 20 keV, differences in the angular distributions for the two elements indicate a strong copper segregation to the surface during bombardment.