Trends in Low‐Temperature Combustion Derived Thin Films for Solution‐Processed Electronics

Abstract Appreciable advancement of low‐temperature combustion processing brings a step closer to the fulfillment of large‐area, flexible electronics. The maximum temperature of deposition is successfully reduced below the softening temperature of the polymeric substrates. The method embodies the incorporation of fuel‐ and oxidizer‐ligands in the precursor, which leads to an exothermic reaction resulting in low‐temperature conversion and/or densification of the metal oxide thin films. A series of electrically conducting, semiconducting, and high permittivity dielectric metal oxides are deposited on varied substrates, including flexible plastic substrates, such as polyimide and aromatic polyester. The combustion processing is efficient in depositing metal, metal oxide, metal–metal oxide composite thin films at considerably low temperatures. In addition, the combustible precursors are considered compatible with diverse solution deposition methods such as spin coating, spray coating, inkjet printing, and blade coating. The combustion processed metal oxide thin films have the potential to exhibit acceptable device performance of thin film transistors, solar cells, gas sensors, organic light emitting diodes, and so on. The present review not only covers the on‐going research in solution combustion‐based deposition, but also discusses potential of the various devices with combustion‐derived thin films of functional oxides as active/passive components.