Insight into Cu(II) Adsorption on Polyamine Resin in the Presence of HEDP by Tracking the Evolution of Amino Groups and Cu(II)–HEDP Complexes

化学 电位滴定法 脱质子化 质子化 吸附 无机化学 配合物的稳定常数 氨基酸 水溶液中的金属离子 滴定法 金属 结晶学 药物化学 离子 物理化学 有机化学 生物化学
作者
Wei Zhao,Zicheng Liu,Yuan Yuan,Fuqiang Liu,Changqing Zhu,Ling Chen,Aimin Li
出处
期刊:ACS Sustainable Chemistry & Engineering [American Chemical Society]
卷期号:7 (5): 5256-5263 被引量:22
标识
DOI:10.1021/acssuschemeng.8b06169
摘要

The presence of low-molecular-weight organic acids (LMWOAs) dramatically influences the species and adsorption behavior of heavy metal ions (HMIs). The effect of 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) on the adsorption of Cu(II) on polyamine resin (PAMD) was investigated by tracking the evolution of amino groups on the PAMD surface and species of Cu(II)–HEDP complexes. First, a simplified proton consumption model was developed to quantify the chemical states of the surface amino groups, which were classified into four categories of different contents and acidity coefficients (pKa) as 2.78 mmol/g (pKa1 = 3.00; defined as type A), 4.44 mmol/g (pKa2 = 6.46; type B), 3.28 mmol/g (pKa3 = 8.64; type C), and 7.40 mmol/g (pKa4 = 10.83; type D). Then, based on theoretical calculations and potentiometric titration, the optimum structure of the Cu(II)–HEDP complexes in the bulk solution were determined to be hexacyclic [Cu(II)L]2–, [Cu(II)HL]−, and [Cu(II)H2L]0 with stability constants of 12.64, 7.07, and 3.80, respectively. When B-type amino group has not been deprotonated, the adsorption mechanism of Cu(II) involved coordination between Cu(II)–HEDP complexes and the deprotonated A-type amino group to form ternary complexes of Cu(II)(R-NH2)2L rather than electrostatic interaction between Cu(II)–HEDP complexes and protonated amino groups. With increasing deprotonation degree of the B-type amino groups, the complexing affinity of PAMD toward Cu(II) increased, resulting in that the ligand competition between HEDP in the liquid phase and deprotonated B-type amino groups on the surface of PAMD, ultimately achieved ligand substitution to form binary complex Cu(II)(R–NH–CH2–CH2–NH2)2. This evolution process provides important guidelines for the development of novel chelate adsorbents resistant to interference by LMWOAs. The enhanced adsorption affinity for HMIs by PAMD can be achieved by reducing the heavy metal complex stability with LMWOAs.
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