小型化
电子元件
电容器
电阻器
可靠性(半导体)
电感器
数码产品
降低成本
电子工程
集成电路
印刷电路板
计算机科学
电气工程
工程类
业务
物理
营销
功率(物理)
电压
量子力学
出处
期刊:Philips Journal of Research
[Elsevier]
日期:1998-01-01
卷期号:51 (3): 353-361
被引量:5
标识
DOI:10.1016/s0165-5817(98)00011-4
摘要
The trend of miniaturization of electronic products has had an effect on the development of passive components. A solution to the problems that are generated by size reduction of discrete passive components is to integrate resistors, capacitors and inductors into a functional passive circuit on one substrate. Various conditions have to be fulfilled in order to justify this integration. Important aspects are manufacturing cost, assembly cost, miniaturization, reliability, functionality and performance. Thin film technology can offer many advantages in all these aspects.
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