聚酰亚胺
材料科学
石墨
复合材料
微晶
热稳定性
热导率
导电体
Crystal(编程语言)
试剂
热的
化学工程
有机化学
冶金
化学
图层(电子)
计算机科学
工程类
程序设计语言
物理
气象学
作者
Meijiao Sun,Xiaoqiang Wang,Zhengyu Ye,Xiaohong Chen,Yuhua Xue,Guangzhi Yang
出处
期刊:Nanomaterials
[MDPI AG]
日期:2022-01-24
卷期号:12 (3): 367-367
被引量:4
摘要
With the large-scale application and high-speed operation of electronic equipment, the thermal diffusion problem presents an increasing requirement for effective heat dissipation materials. Herein, high thermal conductive graphite films were fabricated via the graphitization of polyimide (PI) films with different amounts of chemical catalytic reagent. The results showed that chemically imidized PI (CIPI) films exhibit a higher tensile strength, thermal stability, and imidization degree than that of purely thermally imidized PI (TIPI) films. The graphite films derived from CIPI films present a more complete crystal orientation and ordered arrangement. With only 0.72% chemical catalytic reagent, the graphitized CIPI film achieved a high thermal conductivity of 1767 W·m-1·K-1, which is much higher than that of graphited TIPI film (1331 W·m-1·K-1), with an increase of 32.8%. The high thermal conductivity is attributed to the large in-plane crystallite size and high crystal integrity. It is believed that the chemical imidization method prioritizes the preparation of high-quality PI films and helps graphite films achieve an excellent performance.
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