静电放电
薄脆饼
表征(材料科学)
材料科学
工程类
晶片测试
电气工程
电子工程
光电子学
电压
纳米技术
作者
Marek Scholz,Dimitri Linten,Steven Thijs,Sandeep Sangameswaran,Makoto Sawada,T. Nakaei,Terumitsu Hasebe,Guido Groeseneken
出处
期刊:IEEE Transactions on Instrumentation and Measurement
[Institute of Electrical and Electronics Engineers]
日期:2009-06-23
卷期号:58 (10): 3418-3426
被引量:22
标识
DOI:10.1109/tim.2009.2017657
摘要
The electrical characterization of devices and circuits regarding their electrostatic discharge (ESD) robustness is done by using several measurement tools. Transmission line pulsing (TLP) and human body model (HBM) testing are the commonly used methods. In this paper, TLP and HBM on-wafer setups are presented regarding their electrical schematics, the type of data that is obtained, and the required calibration methodologies. By using three case studies, both test methods are compared by showing their advantages and disadvantages. It is demonstrated that pulsed measurement methods like TLP testing are not always a suitable tool to fully assess the ESD performance of devices or circuits.
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