支柱
材料科学
粘附
接触角
纳米技术
失真(音乐)
接触面积
复合材料
机械
光电子学
机械工程
物理
放大器
CMOS芯片
工程类
作者
Youhua Jiang,Yilian Xiao,Chuanqi Wei
标识
DOI:10.1021/acs.jpclett.4c02834
摘要
It is common sense that the droplet is stickier to substrates with larger solid–liquid contact areas. Here, we report that this intuitive trend reverses for hollowed micropillars, where a decrease in solid–liquid contact area caused by an increase in the pore size of a pillar top leads to an increase in the droplet depinning force. As compared to relief of liquid–vapor interface distortion caused by the sliding of the contact line on filled pillars, the pore hinders the contact line sliding, hence leading to enhanced interface distortion and droplet adhesion. The droplet on hollowed micropillars is completely suspended above the vapor but inherently sticky. Hence, this counterintuitive phenomenon is termed as the sticky superhydrophobic state in contrast to the conventional superhydrophobic state with low adhesion. A model building upon the dynamics of the contact line and liquid–vapor interface, which successfully predicts the droplet depinning force on filled and hollowed pillars, is introduced.
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