Shape Memory Polymers With High Response Temperature and Application in Wellbore Stability

ABSTRACT This study focuses on the preparation and characterization of high glass transition temperature shape memory polymers (HTSMP) for leak plugging applications. The HTSMP was synthesized through a curing reaction and characterized using FTIR spectroscopy, which confirmed the occurrence of a ring‐opening reaction resulting in the formation of hydroxyl groups. The glass transition temperature of HTSMP reached up to 136°C, and it maintained a modulus of over 10 MPa at 200°C. Shape memory performance tests showed that HTSMP samples exhibited a recovery rate ranging from 80% to 95%, with a higher recovery rate observed with increased curing agent content. In sealing performance tests, the addition of HTSMP‐1 significantly improved the plugging effect of conventional plugging agents, with a pressure‐bearing capacity of up to 9.28 MPa at elevated temperatures. These results demonstrate the potential of HTSMP in sealing applications, particularly for addressing fractured leakage in high‐temperature deep wells.