单片微波集成电路
放大器
氮化镓
占空比
调制(音乐)
电气工程
材料科学
功率(物理)
光电子学
脉冲宽度调制
物理
电压
电子工程
工程类
CMOS芯片
纳米技术
量子力学
图层(电子)
声学
作者
Luchuan Zhang,Guangnian Wang,Hongqi Tao,Runnan Guo,Yuan Zhuang,Yan Chen,Min Lv,Longxing Shi
出处
期刊:2018 IEEE MTT-S International Wireless Symposium (IWS)
日期:2022-08-12
卷期号:: 1-3
被引量:1
标识
DOI:10.1109/iws55252.2022.9977671
摘要
A high-power, high-efficiency, 6-18GHz monolithic microwave integrated circuit (MMIC) power amplifier (PA) utilizing active load modulation is devised and evaluated in this document. The ultra-wideband (UWB) MMIC PA, manufactured in $\boldsymbol{0.20-\mu} \mathbf{m}$ gallium nitride (GaN) process, is intended not only with standard passive matching but also with an active methodology to identify the most appropriate impedances. The PA assessment findings indicated a power added efficiency (PAE) of 25% to 38% over 6–18 GHz with an average power gain of 21 dB and an output power greater than 44 dBm (25 W) at a drain voltage of 28V at 1ms pulse width with 10% duty cycle. The chip dimension is 4.7mm × 5.5 mm (25.85 mm 2 ).
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