Influence of temperature gradient bonding on the micromorphology and shear performance of Sn-based solder joints: Experiments and first principles calculations
材料科学
焊接
复合材料
剪切(地质)
温度梯度
物理
量子力学
作者
Zezong Zhang,Wenjing Chen,Xiaowu Hu,Guangbin Yi,Bin Chen,Jue Wang,Lan Jiang,Xiongxin Jiang,Qinglin Li