光伏系统
互连
焊接
制作
材料科学
光伏
丝网印刷
太阳能电池
工艺工程
纳米技术
制造工程
计算机科学
电信
工程类
冶金
光电子学
复合材料
电气工程
病理
医学
替代医学
作者
Yuchao Zhang,Sisi Wang,Liming Wang,Zhenyu Sun,Yuanchih Chang,Ran Chen,Catherine Chan,Kuninori Okamoto,Yiwei Ao,Dongliang Wang,M. Dhamrin,K. Tsuji,Brett Hallam
出处
期刊:Solar RRL
[Wiley]
日期:2024-07-27
卷期号:8 (17)
标识
DOI:10.1002/solr.202400478
摘要
As the photovoltaics industry approaches the terawatt (TW) manufacturing scale, the consumption of silver in screen‐printed contacts must be significantly reduced for all cell architectures to avoid risks of depleting the global silver supply and substantial cost inflations. With alternative metallization techniques (e.g., plating) facing their own challenges for mass production, advancements in the mainstream screen‐printing technology to accelerate the pace of silver reductions are urgently needed. This work presents a silver‐lean screen‐printed contact scheme, providing scope for substantial reductions in silver consumption based on existing industrial screen‐printing capabilities. The initial testing of such a design leads to the fabrication of 24.04% efficient large‐area TOPCon solar cells with 9 mg W −1 silver consumption compatible with existing soldering‐based interconnection technologies, corresponding to a 25% rel reduction in silver usage compared to standard industrial screen‐printed TOPCon solar cells. Upon further optimization in pattern designs and fabrication processes, this silver‐lean design offers a promising pathway toward ultra‐low silver consumption of less than 2 mg W −1 for screen‐printed TOPCon solar cells without sacrificing efficiency.
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