封装(网络)
材料科学
工程类
工程物理
计算机科学
计算机网络
作者
Helinda Nominanda,Wenhao Wu,Jerry R. Chen,Soo Young Choi
摘要
Single layer barrier layer and multi‐layer barrier/buffer/barrier layers thin film encapsulation (TFE) were developed by large area PECVD. The barrier performances as well as mechanical bending flexibility were demonstrated.
科研通智能强力驱动
Strongly Powered by AbleSci AI