材料科学
无定形固体
钝化
欧姆接触
光电子学
热传导
纳米技术
工程物理
复合材料
图层(电子)
化学
有机化学
工程类
作者
Gi Soon Park,SeungJe Lee,Da‐Seul Kim,Sang Yeun Park,Jai Hyun Koh,Da Hye Won,Phillip Lee,Young Rag,Byoung Koun Min
标识
DOI:10.1002/aenm.202203183
摘要
Abstract Ultrathin solar cells (UTSCs) have attracted much research attention because of their superior potential for low‐cost production and diverse applications. For UTSCs to achieve high efficiency, rear‐interface passivation is critical because it has greater influence on thinner absorbers. Conventional passivation layers (e.g., Al 2 O 3 and SiO 2 ) inevitably require patterned contact openings for electrical conduction, the complex processing of which severely impedes the scale‐up production of UTSCs. Herein, this study reports that amorphous TiO 2 layers can act as a passivating contact, which not only passivates defective rear‐interfaces but also provides excellent electrical conduction, for solution‐processed Cu(In,Ga)(S,Se) 2 UTSCs. The amorphous nature of TiO 2 layers is found to play a key role in achieving desirable ohmic conduction over the entire area without any contact openings. Holes in absorbers easily move into amorphous TiO 2 layers, even in the presence of large valence band offset (2.6 eV), proving that the defect states within these TiO 2 layers act as hole conduction pathways. While control devices experience huge open‐circuit voltage ( V OC ) losses (−303 mV) after reduction of absorber thickness from 750 to 300 nm, devices with amorphous TiO 2 layers exhibit V OC gains (+8 mV), encouraging the realization of high‐efficiency UTSCs with a simple, easily scalable, and highly reproducible process.
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