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Interdigitated‐back‐contacted silicon heterojunction solar cells featuring novel MoOx‐based contact stacks

材料科学 异质结 光电子学 纳米技术 工程物理 工程类
作者
Katarina Kovačević,Yifeng Zhao,Paul Prócel,Liqi Cao,Luana Mazzarella,Olindo Isabella
出处
期刊:Progress in Photovoltaics [Wiley]
卷期号:33 (1): 209-218 被引量:3
标识
DOI:10.1002/pip.3812
摘要

Abstract The fabrication process of interdigitated‐back‐contacted silicon heterojunction (IBC‐SHJ) solar cells has been significantly simplified with the development of the so‐called tunnel‐IBC architecture. This architecture utilizes a highly conductive ( p )‐type nanocrystalline silicon (nc‐Si:H) layer deposited over the full substrate area comprising pre‐patterned ( n )‐type nc‐Si:H fingers. In this context, the ( p )‐type nc‐Si:H layer is referred to as blanket layer. As both electrodes are connected to the same blanket layer, the high lateral conductivity of ( p )nc‐Si:H layer can potentially lead to relatively low shunt resistance in the device, thus limiting the performance of such solar cells. To overcome such limitation, we introduce a thin (<2 nm) full‐area molybdenum oxide (MoO x ) layer as an alternative to the ( p )nc‐Si:H blanket layer. We demonstrate that the use of such a thin MoO x minimizes the shunting losses thanks to its low lateral conductivity while preserving the simplified fabrication process. In this process, a novel ( n )‐type nc‐Si:H/MoO x electron collection contact stack is implemented within the proposed solar cell architecture. We assess its transport mechanisms via electrical simulations showing that electron transport, unlike in the case of tunnel‐IBC, occurs in the conduction band fully. Moreover, the proposed contact stack is evaluated in terms of contact resistivity and integrated into a proof‐of‐concept front/back‐contacted (FBC) SHJ solar cells. Contact resistivity as low as 100 mΩcm 2 is achieved, and fabricated FBC‐SHJ solar cells obtain a fill factor above 81.5% and open‐circuit voltage above 705 mV. Lastly, the IBC‐SHJ solar cells featuring the MoO x blanket layer are fabricated, exhibiting efficiencies up to 21.14% with high shunt resistances above 150 kΩcm 2 . Further optimizations in terms of layer properties and fabrication process are proposed to improve device performance and realize the efficiency potential of our novel IBC‐SHJ solar cell architecture.
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