材料科学
合金
金属间化合物
微观结构
电阻率和电导率
极限抗拉强度
晶界
兴奋剂
冶金
位错
纳米尺度
电导率
复合材料
纳米技术
光电子学
化学
物理化学
电气工程
工程类
作者
Bowen Ma,Bei An,Xue Zhang,Yunchao Li,Junyan Du,Engang Wang
标识
DOI:10.1016/j.matlet.2023.133917
摘要
Doping Sc can further improve the mechanical properties of Cu-Cr-Zr alloy without significantly reducing the electrical conductivity of the alloy. Cu-0.5Cr-0.05Cr-(0.3Sc) was selected as the object to study. During the aging process, it is found that Sc is easy to form a new intermetallic compound with Zr, it's atomic ratio was Cu: Zr: Sc = 85.01 ± 2.66:2.41 ± 0.48:12.58 ± 2.57, and the segregation of the intermetallic compound occurred at the grain boundary. After the processing of solution + rolling + aging, the properties of the alloy are further improved, and the generation of nanoscale precipitates and the existence of subgrain are observed in the matrix. It is believed that the effect of dislocation locking of nanoscale precipitates after rolling + aging is the fundamental cause of a large number of dislocations in the alloy. After doping Sc in the Cu-Cr-Zr alloy, the ultimate tensile strength and hardness of the alloy are increased, but the electrical conductivity is not significantly decreased, so the application range of Cu-Cr-Zr alloy is further improved.
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