计算机科学
介绍(产科)
电子线路
故障检测与隔离
电压
分离(微生物学)
断层(地质)
激光器
可靠性工程
计算机硬件
电子工程
电气工程
人工智能
工程类
地质学
放射科
地震学
物理
执行机构
光学
微生物学
生物
医学
作者
Dan Bodoh,Kent Erington
出处
期刊:Proceedings
日期:2021-10-28
标识
DOI:10.31399/asm.cp.istfa2021tpe1
摘要
Abstract This presentation is an application oriented tutorial on laser-assisted device alteration (LADA) and soft defect localization (SDL) techniques and how they are used to analyze marginal digital failures and identify analog circuits that are sensitive to voltage perturbations. The presentation includes well-illustrated instructions for equipment setup and validation, guidelines for collecting and analyzing images, and examples of how to interpret pass/fail sites and assess the effect of laser interactions on circuit behaviors. It also includes a brief overview of time-resolved LADA and introduces the concept of laser-induced fault isolation (LIFA).
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