夹紧
残余应力
材料科学
有限元法
基质(水族馆)
失真(音乐)
压力(语言学)
弧(几何)
复合材料
极限抗拉强度
结构工程
职位(财务)
残余物
热的
冶金
机械工程
工程类
数学
热力学
光电子学
放大器
语言学
海洋学
哲学
CMOS芯片
财务
算法
物理
经济
地质学
作者
Kumar Ujjwal,Mukul Anand,Harish Bishwakarma,Alok Kumar Das
出处
期刊:International Journal of Materials Research
[De Gruyter]
日期:2023-08-09
卷期号:114 (10-11): 872-878
被引量:3
标识
DOI:10.1515/ijmr-2022-0249
摘要
Abstract The distortion of components printed by wire arc additive manufacturing (WAAM) due to repeated thermal cycles affects the build quality. The residual stress generated due to these thermal cycles can be predicted with the help of the finite element method. The temperature distribution and residual stresses in the WAAM component are predicted using a numerical model presented in this paper. Also, the effect of clamping position on the substrate is investigated. For this, two different clamping positions are compared with the unclamped state. The residual stress is minimum for the unclamped case and has maximum strain. The case where the substrate is clamped at the centre generates 77 % more tensile stress when compared with the corner clamped case.
科研通智能强力驱动
Strongly Powered by AbleSci AI