材料科学
光电子学
光子学
波导管
光纤
超短脉冲
激光器
插入损耗
炸薯条
多模光纤
带宽(计算)
中间层
光学
计算机科学
电信
纳米技术
物理
蚀刻(微加工)
图层(电子)
作者
Jason R. Grenier,Lars Brusberg,K. A. Wieland,Juergen Matthies,Chad C. Terwilliger
出处
期刊:Advanced Optical Technologies
[De Gruyter]
日期:2023-08-30
卷期号:12
标识
DOI:10.3389/aot.2023.1244009
摘要
High bandwidth demanding applications such as high-performance computing and hyperscale datacenters are drivers for co-packaged optics, which aims to bring optical signals as close as possible to the electrical computing chips by integrating the electro-optic transceivers and ASICs on the same package substrate. These next-generation switches require advanced fiber-to-chip connectivity and novel packaging concepts to enable sufficient power and cost savings. As such, low-loss, high bandwidth, and high fiber-counts are required at the photonic chip interface. In this work, these challenges are addressed by enabling the multi-fiber push-on (MPO) interface at the edge of integrated glass waveguide substrates and thus leverages the existing fiber connector eco-system. An ultrafast laser process is used to singulate glass wafers into individual photonic chips leaving optical-quality end-facets with <1 μm flatness over the 6.5 mm wide connector region thereby directly enabling low-loss fiber-to-chip edge-coupling. To overcome the high-costs and complex photonic packaging associated with active alignment of the fiber connectors to the glass waveguide interfaces, ultrafast laser-ablated features are accurately positioned on the glass substrate to enable self-alignment of the MPO connector guide-pins resulting in a passive alignment approach. Subsequent mating and de-mating of the MPO connector to the glass waveguide interface yields on average a 0.19 dB increase in the coupling loss compared to using active alignment.
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