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Material Extrusion 3D Printing of PEEK-Based Composites

偷看 挤压 复合材料 材料科学 3D打印 聚合物
作者
Thomas Hanemann,Alexander Klein,Siegfried Baumgärtner,Judith Jung,David Wilhelm,Steffen Antusch
出处
期刊:Polymers [MDPI AG]
卷期号:15 (16): 3412-3412 被引量:20
标识
DOI:10.3390/polym15163412
摘要

High-performance thermoplastics like polyetheretherketone (PEEK), with their outstanding thermal stability, mechanical properties and chemical stability, have great potential for various structural applications. Combining with additive manufacturing methods extends further PEEK usage, e.g., as a mold insert material in polymer melt processing like injection molding. Mold inserts must possess a certain mechanical stability, a low surface roughness as well as a good thermal conductivity for the temperature control during the molding process. With this in mind, the commercially available high-performance thermoplastic PEEK was doped with small amounts of carbon nanotubes (CNT, 6 wt%) and copper particles (10 wt%) targeting enhanced thermomechanical properties and a higher thermal conductivity. The composites were realized by a commercial combined compounder and filament maker for the usage in a material extrusion (MEX)-based 3D-printer following the fused filament fabrication (FFF) principle. Commercial filaments made from PEEK and carbon fiber reinforced PEEK were used as reference systems. The impact of the filler and the MEX printing conditions like printing temperature, printing speed and infill orientation on the PEEK properties were characterized comprehensively by tensile testing, fracture imaging and surface roughness measurements. In addition, the thermal conductivity was determined by the laser-flash method in combination with differential scanning calorimetry and Archimedes density measurement. The addition of fillers did not alter the measured tensile strength in comparison to pure PEEK significantly. The fracture images showed a good printing quality without the MEX-typical voids between and within the deposited layers. Higher printing temperatures caused a reduction of the surface roughness and, in some cases, an enhanced ductile behavior. The thermal conductivity could be increased by the addition of the CNTs. Following the given results, the most critical process step is the compounding procedure, because for a reliable process-parameter-property relationship, a homogeneous particle distribution in the polymer matrix yielding a reliable filament quality is essential.
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