Numerical Study of Fluid Flow and Heat Transfer in Stepped Micro-Pin–Fin Heat Sink

Thermal management of electronic devices is essentially required for its safe working and long-term performance. Substantial amount of heat needs to be dissipated to control the temperature below 85 degree centigrade which is a challenging task for advanced compact electronic devices. In the present work, numerical study has been carried to estimate the heat transfer performance of microchannel having square cuboid pin fins. Effects of varying fin heights of the microchannel have been analysed, and optimum value of fin height has been estimated which comparatively dissipates higher heat. Water has been considered as working fluid. Results indicate that fin height in increasing pattern has shown highest value of heat transfer rate. The variable micro-pin–fin has higher heat transfer rate than that of uniform height pin–fin heat sink. The location of pin–fin also one of the crucial factor in heat transfer dissipation.