材料科学
纳米线
碳化硅
薄脆饼
制作
化学气相沉积
光电子学
平版印刷术
纳米技术
场效应晶体管
硅
晶体管
电压
复合材料
电气工程
医学
替代医学
病理
工程类
作者
Han-Kyu Seong,Seung‐Yong Lee,Heon Jin Choi,Tae Hong Kim,Nam Kyu Cho,Kee Suk Nahm,Sang‐Kwon Lee
出处
期刊:Materials Science Forum
日期:2006-10-15
卷期号:527-529: 771-774
被引量:19
标识
DOI:10.4028/www.scientific.net/msf.527-529.771
摘要
We demonstrate the fabrication and the electrical transport properties of single crystalline 3C silicon carbide nanowires (SiC NWs). The growth of SiC NWs was carried out in a chemical vapor deposition (CVD) furnace. Methyltrichlorosilane (MTS, CH3SiCl3) was chosen as a source precursor. SiC NWs had diameters of less than 100 nm and lengths of several μm. For electrical transport measurements, as-gown SiC NWs were prepared on a highly doped silicon wafer, pre-patterned by a photo-lithography process, with a 400 nm thick SiO2 layer. Source and drain electrodes were defined by e-beam lithography (EBL). Prior to the metal deposition (Ti/Au : 40 nm/70 nm) by thermal evaporation, the native oxide on SiC NWs was removed by buffered HF. The estimated mobility of carriers is 15 cm2/(Vs) for a source-drain voltage (VSD) of 0.02 V. It is very low compared to that expected in bulk and/or thin film 3C-SiC. The electrical measurements from nanowire-based field effect transistor (FET) structures illustrate that SiC NWs are weak n-type semiconductor. We have also demonstrated a powerful technique, a standard UV photo-lithography process, for fabrication of SiC nanowires instead of using EBL process.
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