光学
材料科学
激光器
调制(音乐)
波前
光电子学
脉冲宽度调制
晶片切割
纳秒
物理
功率(物理)
声学
量子力学
薄脆饼
作者
Yu Takiguchi,Masaki Oyaizu,Makoto Nakano,Takashi Inoue,Haruyoshi Toyoda
出处
期刊:Optical Engineering
[SPIE - International Society for Optical Engineering]
日期:2017-07-20
卷期号:56 (7): 077109-077109
被引量:6
标识
DOI:10.1117/1.oe.56.7.077109
摘要
Laser dicing with tightly focused nanosecond pulsed laser light inside a semiconductor wafer is a dry, debris-free dicing method achieved by the generation of thermal microcracks. This method has two practical issues: a dicing speed that is limited by the repetition rate of the pulsed laser and potential damage to integrated circuits on the wafer from excessive laser intensity due to insufficient beam divergence. By correcting aberrations and generating multiple beams via wavefront modulation, multiple focused beams inside the wafer will become sufficiently divergent to avoid undesirable potential laser damage. We confirmed these improvements by dicing sapphire wafers with a pulsed laser and a high-numerical-aperture objective lens.
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