微波食品加热
电子工程
计算机科学
滤波器(信号处理)
光子学
频率响应
倍频器
炸薯条
信号处理
材料科学
光电子学
电信
带宽(计算)
电气工程
数字信号处理
工程类
计算机视觉
作者
Yuhan Yao,Yuhe Zhao,Yanxian Wei,Feng Zhou,Daigao Chen,Yuguang Zhang,Xi Xiao,Ming Li,Jianji Dong,Shaohua Yu,Xinliang Zhang
标识
DOI:10.1002/lpor.202200006
摘要
Abstract Photonic‐assisted microwave frequency identification systems have been extensively explored and widely applied for civil and defense applications. Full integration of this system is a promising candidate in attempts to meet the requirements of reduction in size, weight, and power. Although many integrated photonic chips have been reported in different technologies, none has monolithically integrated all the main active and passive optoelectronic components. Furthermore, previous approaches could identify either a single frequency signal instantaneously or multiple frequency signals statistically, but not both, hindering the practical applications. Here, a highly integrated dual‐modality microwave frequency identification system on a single chip is reported. All critical components including a modulator, a sweeping‐frequency filter, a frequency‐selected filter, an amplitude comparison function, and parallel photodetectors, are monolithically integrated on the silicon‐on‐insulator platform. Thanks to the dual‐modality scheme, the chip is able to identify different types of microwave signals, including single‐frequency, multiple‐frequency, chirped, and frequency‐hopping microwave signals, as well as discriminate instantaneous frequency variation among the frequency‐modulated signals. This demonstration exhibits a highly integrated solution and fully functional microwave frequency identification, which can meet the requirements in reduction of size, weight, and power for future advanced microwave photonic processor.
科研通智能强力驱动
Strongly Powered by AbleSci AI