微晶
材料科学
摩擦学
离子镀
扫描电子显微镜
透射电子显微镜
铜
场发射显微术
复合材料
冶金
分析化学(期刊)
衍射
薄膜
纳米技术
光学
摩擦学
化学
物理
色谱法
作者
X-M Gao,Ming Hu,J-Y Sun,L-J Weng,Feng Zhou,WM Liu
标识
DOI:10.1177/1350650111413638
摘要
Cu films were prepared by arc ion plating (AIP) at low temperature ( T s ) and investigated by X-ray diffraction, field emission scanning electron microscope atomic force microscopy, transmission electron microscope, etc. It is found that low T s (≤ 221 K) can refine the crystallite size of the Cu films and leads to compact and smooth surface structure. Further decreasing T s to 135 K makes the inter-grain gaps turn bigger. The wear behaviours of the Cu films in vacuum were characterized using a ball-on-disk tribometer. The results show that the Cu films deposited at the T s range of 135–221 K have better wear resistance, and the wear rates are two to three orders lower than that of the film deposited at room temperature. The compact and dense arrangement of nanoscale crystallites significantly contributes to the improved film–substrate adhesion and so the excellent antiwear behaviour.
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