The Possibility of Using 193 NM Immersion Lithography Process For 5 NM Logic Design Rules

It is generally accepted that the Extreme Ultra-Violet (EUV) lithography has been used in large scale starting at the 5 nm logic technology node. Here we perform an analysis on the possibility of manufacturing the 5 nm design with 193 nm immersion lithography with multiple patterning techniques as it has aroused quite some interest in the industry. We will analyze process challenges from linewidth uniformities and overlay, as well as the challenges in etch process.