Francesco Toniolo,Helen Bristow,Maxime Babics,Lívia Mesquita Dias Loiola,Jiang Liu,Ahmed Ali Said,Lujia Xu,Erkan Aydın,Thomas G. Allen,Moreno Meneghetti,Suzana P. Nunes,Michele De Bastiani,Stefaan De Wolf
出处
期刊：Nanoscale [The Royal Society of Chemistry] 日期：2023-01-01卷期号：15 (42): 16984-16991被引量：16
Vacuum lamination is currently the best encapsulation for perovskite/silicon tandems. Here, we study the lamination process with two different thermoplastic encapsulants, comparing tandem performance and stability, according to IEC standards of certification.
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